旭崇 FOG/FOB 邦定设备 XCH77-A6

旭崇 FOG/FOB 邦定设备 XCH77-A6

FOG/FOB Bonding M/C

 

Application:

本产品适用于各种液晶屏（LCD PANEL）、触摸功能玻璃（SENSOR GLASS）、硬质线路板（PCB、PCBA）与柔性线路板（FPC、COF、TAB）在FOG、FOB工艺中的热压邦定。

 

The machine is used for bonding all kinds of FPC, COF, TAB and liquid crystal screen panel (LCD PANEL), SENSOR GLASS, PCB, and PCBA multi stations assembly.

 

Details:

高清影像系统   High definition visual system

两段独立温控系统   Temperature controlling

LED光源控制器   LED light controller

X轴气缸定位卡   X-axis locating part

X-Y-θ压头调节机构  Adjusting group of pressure head

X-Y-Z轴机构   Group of X-Y-Z Moving Axis

安全光栅保护装置  Grating protection

FPC工作平台X-Y-θ调节机构  Micrometer adjuster

静电消除装置   Anti-static Device

PCB、COF托架   PCB, COF bracket

CCD对位机构    CCD aligning group

 

Introduction:

1 开机复位，设备回原点

2 点击人机界面进入自动模式

3 人工从左边上料，X Y 向定位卡定位，按下真空，平台将Panel 吸附，X定位卡下降

4 按下双手启动，Panel 平台移载到视觉对位处

4 将PCB 放置于平台上，按PCB 真空按键，PCB 平台将PCB 吸住， Panel 平台Z轴下降至邦定位

5 手动调节PCB 治具X-Y-θ 进行对位

6 按下双启动按钮，Panel 平台移栽到邦定位，下压、邦定

7 邦定完成后，平台移动到下一个邦定位，段位邦定完成回到下料位，人工下料

 

1. Start and reset machine, the machine go back to origin.

2. Enter auto mode.

3. Put panel onto platform and positioned by locating parts. Turn on vacuum to attach panel, X axis locating part goes down.

4. Put PCB onto fixture, press vacuum button to attach it, panel platform down to bonding position.

5. Adjust PCB fixture manually to align with panel.

6. Press double start button, platform moves to bonding position, pressure head goes down to bond.

7. Bonding finished, platform moves to next bonding position (can set multi-station bonding), platform moves to discharge area.

 

Parameters:

输入电源：AC380V 50-60HZ

Input power: AC380V 50-60HZ

额定功率：7KW

Rated power: 7KW

工作气压：0.4-0.7Mpa

Working pressure: 0.4-0.7 Mpa

压头尺寸：L230mm×W2.0mm（可定制）

Size of Pressure Head: L230mm×W2.0mm (can be customized)

加热方式：恒温

Method of heating: Constant temperature

对位方式：上下CCD 对位

Method of Alignment: CCD top and bottom alignment

压头机构：电机+气缸

Group of Pressure Head: Motor + Cylinder

LCD载台：X-Y-Z 3轴电机驱动

LCD Platform: X-Y-Z motor driving

控制系统：日本松下PLC+ pro人机界面

Controlling System:  Panasonic PLC+ pro touch screen

外型尺寸：L1500*W1200*H2200MM（含报警灯）

Dimension: L1500*W1200*H2200MM (include alarm lamp)

真空处理：真空泵

Vacuum Processing: Vacuum Pump

设备重量：850KG（以实物为准）

Weight of Machine: 850KG (prevail in kind)

 

Features:

1 高清影像系统：2组CCD上对位另加十字线显示器精准对位，也可根据工艺需求定制上下CCD机构

2 两段独立温度系统：等比例分切、多温区控制、精准通讯，确保温度精准性

3 LED光源控制器：同轴光镜头光源可根据产品工艺需求调整，可满足OGS、FILM-TP、GLASS-TP、液晶屏、电子纸等不同类型的对位成像

4 X轴气缸定位卡：左进左出的上料方式便于单人同方向操作，X-Y-Z活动的定位卡装置，更便捷地保证产品的位置精度

5 X-Y-θ 压头调节机构：调节方便，压头水平度高；自动卷皮轮，邦定完成可自动卷动热压皮，频率及长度均可设置

6 X-Y-Z 轴机构：载台X-Y-Z伺服控制，满足OGS、FILM-TP、GLASS-TP、液晶屏、电子纸等不同类型的产品在FOG、FOB、OLB、PWB等多位置邦定工艺中的需求

7 安全光栅保护装置：更好保证了操作人员因操作失误带来的人员伤害

8 FPC 工作平台 X-Y-θ 调节机构：X-Y-θ 千分尺调节夹具组。真空吸附，达到快速定位，提高效率

9 静电消除装置：可降低静电对产品的需求，同时避免因气流所导致的温度差异和对位影响

10  PCB、COF托架：应用在多段邦定中，由于多段产品邦定X轴移动过程中的重力下垂所导致的不良及不便捷

11 CCD对位机构：采用千分尺X-Y-Z精准调节，调焦便捷，精确

 

1. 2 CCD top alignment and special display guarantee aligning accuracy, CCD top or bottom alignment can be customized.

2. Multi-section temperature controlling guarantees the temperature accuracy.

3. Camera light source can be adjusted as needed, suitable for imaging OGS, FILM-TP, GLASS-TP, LCD, EPD PANEL.

4. Left side loading and discharging is easy to operate by one operator, and X-Y-Z locating parts guarantee locating accuracy of products.

5. Adjusting group of pressure head is easy to operate, Collector of silicone rubber can roll automatically, rolling frequency and length can be set.

6. Servo controlling of platform is suitable for multi station bonding of OGS, FILM-TP, GLASS-TP, LCD, EPD PANEL in FOG, FOB, OLB, PWB process.

7. With the design of grating protection, the machine can avoid injuries caused by operational errors.

8. Fixture is adjusted by micrometer adjuster and with vacuum attaching function that can position fast.

9. Anti-static device can deduce impact from static to products, and also can avoid temperature difference and aligning accuracy caused by airflow.

10. PCB, COF bracket are used in multi section, it can avoid defective caused by hang down during moving in X multi station bonding.

11. CCD aligning group adopt micrometer adjuster which is convenient to focus and with high accuracy.

 

Process:

FOG、OLB邦定  FOG, OLB Bonding

FOB、PWB邦定  FOB, PWB Bonding

 

Accessories:

感压纸  Sensitive Paper

ACF    ACF

硅胶皮   Silicone Rubber

ACF去除液   ACF Remover

无尘布  Dust-free Cloth

酒精  Ethanol

棉棒  Cotton Swab